The tool supports a variety of standard lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, with the option of back-side alignment. Additionally the system offers additional capabilities for multi-purpose configurations, including bond alignment and nanoimprint lithography (NIL). The EVG610 offers quick processing and re-tooling for changing user requirements with a conversion time between lithography and NIL of just a few minutes. Its advanced multi-user concept can be adapted from beginners to expert level, thus making it ideal for universities and R&D applications.
For imprint processes, the EVG610 allows substrates ranging from small chip size pieces up to 150 mm in diameter. Configurations for nanotechnology applications can include release mechanisms for stamps in addition to programmable high and low contact force. Uniform contact force for high yield imprinting is provided by EV Group's proprietary chuck design, which supports both soft and hard stamps.
|Wafer diameter (substrate size)|
|Standard lithography: pieces up to 150 mm|
|Soft UV-NIL: pieces up to 150 mm|
|≤ 40 nm (resolution dependent upon template and process)|
|Mercury light source or UV LED light source|
|Working stamp fabrication|