Visit our booth at the MicroNanoFabrication Annual Review Meeting 2025!
Visit our booth #L1300!
Visit our booth #330 and our PDC "Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Advanced Interconnects" held by Dr. Viorel Dragoi on 27th of May and listen as well to our talks “Advanced FO PLP Digital Lithography Patterning Development for AI Devices” & “Wafer-to-Wafer Bonding With Saddle-Shaped Wafers” held by Dr. Ksenija Varga and Anton Alexeev on 29th of May. We are also looking forward to meet you at the poster session on 29th of May where Urban Peter will present “IR Laser Debonding for Silicon Based Temporary Carrier Systems Enabling 2.5D and 3D Chiplet Integration Processes”
Visit us at our booth at the Leti Innovation Days 2025!
Visit our Booth B1.141!