展示会・セミナー

SEMICON Europa 2026

Visit our booth #B1241 at SEMICON EUROPA 2026 & our poster presentations at the APC:

“Software-Driven Strategies for Advanced Multi-Die Patterning in Digital Lithography “ presented by Business Development Manager Dr. Ksenija Varga and ”Leveraging Advanced Bonding Technologies to Enable Scalable Co-Packaged Optics Architectures” introduced by Business Development Manager Elisabeth Brandl.

Here you'll find more Information on the program. 

Furthermore you'll find our Corporate Sales & Marketing Director Thomas Uhrmann at the Panel Discussion “SEMICONDUCTOR TOUR 2026” presented by YOLE Group on 12th of November at the Novotel München Messe. Click here for more Information.

Industrial Print Integration Conference (IPI) 2026

Listen to our Keynote “Advancing AR/VR and CPO: EV Group’s Inkjet Solutions for Next-Generation Optics” held byJohanna Rimböck (Technology Development).

For more information about the program click here. 

EPTC 2026

Visit our Booth #2 & listen to our talks:

"Scalable Manufacturing Approaches for Co-Packaged Optics via NIL and Advanced Wafer Bonding" held by Director Business Development Dr. Bernd Dielacher.

“Advancing 310×310 mm² Panel Level Packaging: High Throughput Pathways to High Yield 3D Integration” and “Plasma–Enabled Die Singulation on Film Frame Carrier for Advanced HBM and Logic Die Integration” by Business Development Manager Dr. Ksenija Varga.

“Hybrid Bonding Overlay Reduction Through Lithographic Pre-Compensation of the Residual Fingerprint” by Technical Program Manager Sander Grosemans.

EVG & Brewer Science: “Polymer Buffer Layer Enabling a Novel RDL–First Process Flow using a Silicon Carrier and IR Laser Debonding Technology” shared presentation, Peter Urban & Brewer Science. 

EVG & CEA–Leti: “Nanometer Level Chip- Scale Transfer Enabled by IR Laser Debond Technology”. 

Check out the program here. 

SEMICON Japan 2026

Visit our Booth!