Visit our booth #C1311 at SEMICON EUROPA 2024 & listen to our talks:
"Challenges of new chiplet integration – how organic interposers challenge BEOL equipment" held by Brandl Elisabeth on November 13rd, 10:05 at the Advanced Packaging Conference.
"Latest Innovations in MEMS Wafer Bonding" held by Dr. Uhrmann Thomas on November 14th, 12:10 at the MEMS & Imaging Sensors Summit!
Wednesday, Dec 04, 2024
2024年12月11日 (水) - 13日 (金) 10:00-17:00
東京ビッグサイト