Meet EVG at booth #3483 at SEMICON China 2025!
Visit us at our booth at the CS / PIC and PE International Conference and listen to our talks:
"Leveraging NIL for µLED Lens Packaging " held by Business Development Manager Thomas Achleitner at the CS Conference.
"The Future Role of Bonding in Photonic Integrated Circuits and Co-Packaged Optics" held by Business Development Manager Bernd Dielacher at the PIC Conference.
Listen to our talks "Wafer Bonding Advances & 3D Applications" held by our Representative Director Hiroshi Yamamoto on 9:30 Wednesday, April 16 / Room B and "Hybrid Bonding for Heterogenous Integration" held by our Process Technology Manager Europe Gerald Mittendorfer on 12:40 Friday, April 18 / Room A.
Visit our booth #A308
Visit our booth at the MicroNanoFabrication Annual Review Meeting 2025!
Visit our booth #L1300!
Visit our booth #330 and our PDC "Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Advanced Interconnects" held by Dr. Viorel Dragoi on 27th of May!
Visit us at our booth at the Leti Innovation Days 2025!
Visit our Booth B1.141!