展示会・セミナー

SEMICON China 2025

Meet EVG at booth #3483 at SEMICON China 2025!

26.03. - 28.03.2025

Shanghai, China

CS / PIC / PE International Conference 2025

Visit us at our booth at the CS / PIC and PE International Conference and listen to our talks:

"Leveraging NIL for µLED Lens Packaging " held by Business Development Manager Thomas Achleitner at the CS Conference.

"The Future Role of Bonding in Photonic Integrated Circuits and Co-Packaged Optics" held by Business Development Manager Bernd Dielacher at the PIC Conference.

07.04. - 09.04.2025

Brussels, Belgium

ICEP 2025

Listen to our talks "Wafer Bonding Advances & 3D Applications" held by our Representative Director Hiroshi Yamamoto on 9:30 Wednesday, April 16 / Room B and "Hybrid Bonding for Heterogenous Integration" held by our Process Technology Manager Europe Gerald Mittendorfer on 12:40 Friday, April 18 / Room A.

15.04. - 19.04.2025

Nagano, Japan

JFS Conference and Compoundsemiconductor Industry Expo 2025

Visit our booth #A308

23.04. - 25.04.2025

Wuhan, China

MicroNanoFabrication Annual Review Meeting 2025

Visit our booth at the MicroNanoFabrication Annual Review Meeting 2025!

13.05. - 13.05.2025

Ecublens, Switzerland

Semicon South East Asia 2025

Visit our booth #L1300!

20.05. - 22.05.2025

Singapore, Singapore

ECTC 2025

Visit our booth #330 and our PDC "Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Advanced Interconnects" held by Dr. Viorel Dragoi on 27th of May!

27.05. - 30.05.2025

Dallas, USA