展示会・セミナー
IEEE ESTC 2026
Listen to our talk "Digital Multi–Die Patterning Approach for High–Density Packaging" held by Business Development Manager Dr. Ksenija Varga.
More Information here.
MicroLED Connect 2026
Listen to our talk “From Nanostructures to New Realities: The Role of Nanoimprint Lithography in AR” held by Business Development Manager Thomas Achleitner.
Here you'll find the program.
SEMICON India 2026
Visit our booth 955!
iMAPS Symposium on Microelectronics 2026
Listen to our talk "Copper Pillar Patterning Using Digital Exposure Technology with Dry Film Resists for 2.5D PLP" held by Business Development Manager Dr. Ksenija Varga and visit our booth #618!
Click here for more information on the program.
NNT 2026
Listen to our talk “Integration of Spin-On Transfer Layers in Nanoimprint Lithography for High-Aspect-Ratio Etch Transfer” held by Patrick Schuster from our Technology Development Team.
Click here for the program.
250th ECS Meeting
Listen to our talks: "Simulation-Informed Real-Time Wafer-to-Wafer Bonding Process Control under Varying Surface Conditions" held by Dr. Lukas Koller from our Process Modelling & Simulation Team and “Low Temperature Plasma Treated Silicon Nitride Based Dielectrics for Direct Wafer Bonding Processes” held by Deputy Team Leader Process Technology - Fusion Bonding David Doppelbauer.
Here you'll find the program.
SEMICON Europa 2026
Visit our booth #B1241 at SEMICON EUROPA 2026 & our poster presentations at the APC:
“Software-Driven Strategies for Advanced Multi-Die Patterning in Digital Lithography “ presented by Business Development Manager Dr. Ksenija Varga and ”Leveraging Advanced Bonding Technologies to Enable Scalable Co-Packaged Optics Architectures” introduced by Business Development Manager Elisabeth Brandl.
Here you'll find more Information on the program.
Industrial Print Integration Conference (IPI) 2026
Listen to our Keynote “Advancing AR/VR and CPO: EV Group’s Inkjet Solutions for Next-Generation Optics” held byJohanna Rimböck (Technology Development).
For more information about the program click here.
EPTC 2026
Visit our Booth #2 & listen to our talks:
"Scalable Manufacturing Approaches for Co-Packaged Optics via NIL and Advanced Wafer Bonding" held by Director Business Development Dr. Bernd Dielacher and
“Advancing 310×310 mm² Panel Level Packaging: High Throughput Pathways to High Yield 3D Integration” and “Plasma–Enabled Die Singulation on Film Frame Carrier for Advanced HBM and Logic Die Integration” by Business Development Manager Dr. Ksenija Varga.
Check out the program here.
SEMICON Japan 2026
Visit our Booth!