展示会・セミナー
ICEPT 2026
Listen to our presentation "Fusion & Hybrid Bonding: Driving Application Performance, Power and Cost by Mixing and Matching Semiconductor Technologies" held by Business Development Manager Dr. Thomas Pleschke.
Imaps Silicon Valley presents Accelerating Innovation in Advanced Packaging and Heterogeneous Integration with AI
Listen to our talk: “The Critical role of Hybrid Bonding in driving Architectures for AI and High-performance Computing” in Session 2 held by Vineeth Reddy Bijjam, Technology Director North America.
Click here to find out more about it.
SEMICON Taiwan 2026
Visit our booth #L0310 and listen to our talk at the Heterogeneous Integration Global Summit :“Enabling Scalable CPO Architectures Through Nanoimprint Lithography and Direct Bonding” held by Business Development Director Dr. Bernd Dielacher.
IEEE ESTC 2026
Listen to our talk "Digital Multi–Die Patterning Approach for High–Density Packaging" held by Business Development Manager Dr. Ksenija Varga.
More Information here.
MicroLED Connect 2026
Listen to our talk “From Nanostructures to New Realities: The Role of Nanoimprint Lithography in AR” held by Business Development Manager Thomas Achleitner.
Here you'll find the program.
Semicon India 2026
Visit our booth 955!
iMAPS Symposium on Microelectronics 2026
Listen to our talk "Copper Pillar Patterning Using Digital Exposure Technology with Dry Film Resists for 2.5D PLP" held by Business Development Manager Dr. Ksenija Varga and visit our booth #618!
Click here for more information on the program.
SEMICON WEST 2026
Visit us at booth #2039 at SEMICON West 2026!
NNT 2026
Listen to our talk “Integration of Spin-On Transfer Layers in Nanoimprint Lithography for High-Aspect-Ratio Etch Transfer” held by Patrick Schuster from our Technology Development Team.
Click here for the program.
250th ECS Meeting
Listen to our talks: "Simulation-Informed Real-Time Wafer-to-Wafer Bonding Process Control under Varying Surface Conditions" held by Dr. Lukas Koller from our Process Modelling & Simulation Team and “Low Temperature Plasma Treated Silicon Nitride Based Dielectrics for Direct Wafer Bonding Processes” held by Deputy Team Leader Process Technology - Fusion Bonding David Doppelbauer.
Here you'll find the program.