Known for its automation flexibility and reliability, these systems provide state-of-the-art mask alignment technology on a minimized footprint. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes them the ideal solution for any R&D environment up to semi-automated volume production. The tool supports a variety of standard lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, with the option of back-side alignment. Additionally the system offers additional capabilities for multi-purpose configurations, including bond alignment and nanoimprint lithography. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.
SmartNIL is the industry-leading NIL technology, enabling the patterning of extremely small features down to less than 40 nm*, as well as a wide range of structure sizes and shapes. SmartNIL in combination with multi-use soft-stamp technology enables unmatched throughput with considerable cost-of-ownership advantages while preserving scalability and maintenance-friendly operation. EVG’s SmartNIL redeems the long-term promise of nanoimprinting being a low-cost and high-volume alternative lithography technology for mass manufacturing of micro- and nanoscale structures.
*resolution dependent on process and template
|Wafer diameter (substrate size)|
|Standard lithography: 75 up to 200 mm|
|Soft UV-NIL: 75 up to 200 mm|
|SmartNIL®: up to 150 mm|
|≤ 40 nm (resolution dependent upon template and process)|
|Soft UV-NIL & SmartNIL®|
|Mercury light source or UV LED light source|
|Soft-NIL: ≤ ± 0.5 µm|
|SmartNIL®: ≤ ± 3 µm|
|Soft UV NIL: not supported|
|Working stamp fabrication|
|Soft UV-NIL: external|