EVG®610

UV Nanoimprint Lithography System

Mask alignment system with UV Nanoimprint Lithography capability from small pieces up to 150 mm

The tool supports a variety of standard lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, with the option of back-side alignment. In addition, the system offers conventional UV Nanoimprint Lithography (soft UV-NIL) and allows quick processing and re-tooling for changing user requirements with a conversion time between lithography and NIL of just a few minutes. Its advanced multi-user concept can be adapted from beginners to expert level, thus making it ideal for universities and R&D applications.

Features

  • Top-side and bottom-side alignment capability
  • High-precision alignment stage
  • Automated wedge error compensation mechanism
  • Motorized and recipe-controlled exposure gap
  • Supports the latest UV-LED technology
  • Minimized system footprint and facility requirements
  • Step-by-step process guidance
  • Remote tech support
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
  • Agile processing and conversion between lithography processes 
  • Table top or stand-alone version with anti-vibration granite table
  • Additional capabilities:
    • Bond alignment
    • IR alignment
    • Nanoimprint lithography 
    • µ-contact printing
EVG610

Technical Data

Wafer diameter (substrate size)
Standard lithography: pieces up to 150 mm
Soft UV-NIL: pieces up to 150 mm
Resolution
≤ 40 nm (resolution dependent upon template and process)
Supported Process
Soft UV-NIL
Exposure source
Mercury light source or UV LED light source
Automated separation
Not supported
Working stamp fabrication
External

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