EVG is the market-leading equipment supplier for nanoimprint lithography (NIL). Pioneering this non-conventional lithography technique for many years, EVG mastered NIL and has implemented it in volume production on ever-increasing substrate sizes. EVG's proprietary SmartNIL technology is optimized by years of research, development and field experience to address nanopatterning requirements that cannot be supported by conventional lithography. SmartNIL provides superior conformal imprint results down to 40 nm and smaller.
NIL has proven to be the most cost-efficient way to enable nano-scale patterns on large areas since it is not limited by sophisticated optics that are required with optical lithography, and since it can provide optimal pattern fidelity for extremely small (sub-100 nm) structures.
EVG's SmartNIL is a full-field imprint technology based on UV exposure, providing a powerful next-generation lithography technique with almost unlimited structure size and geometry capabilities. Since SmartNIL incorporates multiple-use soft stamp processing, it also enables unmatched throughput with considerable cost-of-ownership advantages while preserving scalability and maintenance-friendly operation. In addition, the lifetime of the master template is extended to periods comparable to masks used for optical lithography.
New application developments are often closely linked to advances in equipment capabilities. SmartNIL is a key enabling technology for many new innovations in displays, biotechnology and photonic applications. For example, SmartNIL provides unmatched full-area conformal imprinting in order to fulfill the most important criteria for wire grid polarizers on panel substrates. SmartNIL is also ideally suited for high-precision patterning of microfluidic chips with complex nanostructures to support the production of next-generation pharmaceutical research and medical diagnostics devices. Furthermore, recent developments in SmartNIL offer additional degrees of freedom to manufacture innovative photonic structures with the highest functionality, smallest form factors and high volumes, which are key for enabling Diffractive Optical Elements (DOEs), optical waveguides and other micro- and nanophotonic elements used for 3D sensing and biometric authentication.

Visit our booth #B1241 at SEMICON EUROPA 2025 & visit our poster presentation at the APC:
"High Throughput Digital Lithography Development for 3D Device Integration " held by Business Development Manager Dr. Ksenija Varga.

Visit EVG's booth at The International Conference on Wafer Bonding and listen to our talks:
"Impact of Surface Condition on In-Plane Distortion in Si Wafer Bonding: Correlation with Adhesion Energy and Bondwave Propagation Speed" by Technology Development Dr. Christoph Flötgen.
“Advanced IR Laser Debonding on Silicon Wafers for RDL- first FOWLP” by Supervisor Process Technology Peter Urban.
“D2W Bonding of III-V and piezo electrical materials for Heterogeneous Integration” by Team Leader Process Technology Mariana Pires.
“Comprehensive Bond strength optimization of LiTaO3 bonding using ComBond Technology” by Supervisor Process Technology Michael Dornetshumer.
“ComBond Bonding of Diamond and other Materials for Advanced Thermal Management” by Senior Process Technology Engineer Matthias Danner.
and visit the Poster Presentation, where we present following topic:
“Comparative Analysis of Atmospheric and ComBond-Activated TiTi thermos-compression Bonding” by Team Leader Process Technology Thomas Stöttinger.

Visit our Booth #20 & listen to our talks:
"The Critical Role of Wafer Bonding in Next-Generation Interconnect Scaling" held by Team Leader Business Development Dr. Bernd Dielacher and
“Innovation and Efficiency in 3D Packaging Enabled by Optimized Integration Processes ” by Business Development Manager Dr. Ksenija Varga.
Contact the EVG experts