EVG is the market-leading equipment supplier for nanoimprint lithography (NIL). Pioneering this non-conventional lithography technique for many years, EVG mastered NIL and has implemented it in volume production on ever-increasing substrate sizes. EVG's proprietary SmartNIL technology is optimized by years of research, development and field experience to address nanopatterning requirements that cannot be supported by conventional lithography. SmartNIL provides superior conformal imprint results down to 40 nm.
NIL has proven to be the most cost-efficient way to enable nano-scale patterns on large areas since it is not limited by sophisticated optics that are required with optical lithography, and since it can provide optimal pattern fidelity for extremely small (sub-100 nm) structures.
EVG's SmartNIL is a full-field imprint technology based on UV exposure, providing a powerful next-generation lithography technique with almost unlimited structure size and geometry capabilities. Since SmartNIL incorporates multiple-use soft stamp processing, it also enables unmatched throughput with considerable cost-of-ownership advantages while preserving scalability and maintenance-friendly operation. In addition, the lifetime of the master template is extended to periods comparable to masks used for optical lithography.
New application developments are often closely linked to advances in equipment capabilities. SmartNIL is a key enabling technology for many new innovations in displays, biotechnology and photonic applications. For example, SmartNIL provides unmatched full-area conformal imprinting in order to fulfill the most important criteria for wire grid polarizers on panel substrates. SmartNIL is also ideally suited for high-precision patterning of microfluidic chips with complex nanostructures to support the production of next-generation pharmaceutical research and medical diagnostics devices. Furthermore, recent developments in SmartNIL offer additional degrees of freedom to manufacture innovative photonic structures with the highest functionality, smallest form factors and high volumes, which are key for enabling Diffractive Optical Elements (DOEs), optical waveguides and other micro- and nanophotonic elements used for 3D sensing and biometric authentication.

Besuchen Sie unseren Stand #C740 und hören Sie sich unseren Vortrag “EVG LayerRelease Technology ; Key Innovations in Carrier Systems: Addressing D2W and W2W Stacking Requirements” gehalten von Corporate Sales & Marketing Director Dr. Thomas Uhrmann, an sowie “High Throughput Digital Lithography Development Enables AI and HPC Device Integration” von Dr. Ksenija Varga.

Besuchen Sie unseren Stand #616 und hören Sie sich folgende Vorträge an:
am 25. Februar: “High aspect ratio copper pillar structures enabled by digital lithography patterning of thick resists for AI and HPC device packages” präsentiert von Dr. Ksenija Varga.
am 26. Februar: "Ultrasonic spray coating combined with maskless lithography for advanced wafer singulation with complex bump geometries" gehalten von Johanna Rimböck und “Lithography Digitalization in Semiconductor Technologies Through Advanced Software Development of High Throughput Maskless Exposure” präsentiert von Alois Malzer.

Besuchen Sie EVG am Stand #505
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