EVG®301

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JA 日本語 (JA)

R&D type single wafer cleaning system

The EVG301 semi-automated single wafer cleaning system employs one cleaning bowl. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding, or it can be combined with EVG’s debondig systems to remove the temporary bonding adhesive after debond.

Features

Available for aqueous based cleaning applications such as silicon direct bonding
Available for solvent based cleaning applications such as post-debond cleans
High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
Brush scrubbing for single-side cleaning (option)
Diluted chemicals for wafer cleaning
Prevents cross-contamination from back to front side
Fully software-controlled cleaning process
Options
- Pre-bonding station with IR-inspection
- Tooling for non-SEMI standard substrates

Technical Data

Wafer diameter (substrate size)
200, 100 - 300 mm

Cleaning system
Open chamber, spinner and cleaning arm
Chamber: made of PP or PFA (option)
Cleaning media: DI-water (standard), other cleaning media (option)
Spinner chuck: vacuum chuck (standard) and edge handling chuck (option) made of metal ion free and clean materials
Rotation: up to 3000 rpm (in 5 sec)

Megasonic nozzle
Frequency: 1 MHz (3 MHz option)
Output power: 30 - 60 W
DI-water flow rate: up to 1.5 liter/min
Effective cleaning area: Ø 4.0 mm
Material: PTFE

Megasonic area transducer
Frequency: 1 MHz (3 MHz option)
Output power: max. 2.5 W/cm² active areas (max. output 200 W)
DI-water flow rate: up to 1.5 liter/min
Effective cleaning area: triangle shape that guarantees radio uniformity on whole wafers per each rotation
Material: SS and sapphire