Softbake, post-exposure bake and hardbake processes can be performed on the EVG105 bake module. Controlled baking environment assures uniform evaporation. Programmable proximity pins provide the best available control of resist hardening processes and temperature profiles. The EVG105 bake module can process up to 300 mm wafer sizes or up to four 100 mm wafers at the same time.
|Wafer diameter (substrate size)|
|Up to 300 mm|
|Temperature range: ≤ 250 °C|
|Manual adjustment of lift pins to desired proximity gap|