Single-wafer resist processing in R&D and small-scale production
The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.
Features
- Wafer size up to 300 mm
- Automated spin or spray coating or developing with manual wafer load/unload
- Quick and easy process transfer from research to production utilizing proven modular design and standardized software
- Syringe dispense system for utilization of small resist volumes, including high-viscosity resists
- Small footprint while maintaining a high level of personal and process safety
- Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
- Options:
- Uniform coating of high-topography wafer surfaces with OmniSpray® coating technology
- Wax and epoxy coating for subsequent bonding processes
- Spin-On-Glass (SOG) coating
Technical Data
| Available modules |
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| Spin coat / OmniSpray® / develop |
| Dispense options |
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| Various resist despense pumps to cover a wide range of viscosities up to 52000 cP |
| Liquid priming / pre-wet / bowl wash |
| Edge bead removal (EBR) / back-side rinse (BSR) |
| Constant pressure dispense systems / syringe dispense system |
| Smart process control & data analysis features (framework SW platform) |
|---|
| Integrated analysis features for process and machine control |
| Parallel task / queueing task processing feature |
| Equipment and process performance tracking feature |
| Smart handling features |
| Occurences & alarms analysis / smart maintenance management & tracking |
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm |
| Spin coat module - spinner parameter |
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| Spin speed: up to 10 k rpm |
| Acceleration speed: up to 10 k rpm |
| Spray coat module - spray generation |
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| Ultrasonic atomization nozzle / high-viscosity nozzle |
| Develop module - dispense options |
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| Puddle development / spray development |
| Additional module options |
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| Pre-alignment: mechanical |
| System control |
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| Operations system: Windows |
| File sharing & back-up solution / unlimited no. recipes & parameters / offline recipe editor |
| Flexible process flow definition / easy drag and drop recipe programming |
| Parallel processing of multiple jobs / real-time remote access, diagnostics & troubleshooting |
| Multi-language user GUI & support: CN, DE, FR, IT, JP, KR |