The perfect solution for single-wafer resist processing in R&D and small-scale production
The EVG101 resist processing system, which is fully compatible with EVG´s automated systems, performs R&D-type processes on a single chamber design. A compact layout with small footprint allows the user semi-automated processing of wafers on an industrial level for the development of new devices or processes.
Features
- Wafer size ranges from small pieces, square and round substrates up to 300 mm
- Automated spin or spray coating or developing with manual wafer load/unload
- Quick and easy process transfer from research to production utilizing proven modular design and standardized software
- Syringe dispense system for utilization of small resist volumes, including high-viscosity resists
- Small footprint while maintaining a high level of personal and process safety
- Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
- NRTL listed
- Options:
- Uniform coating of high-topography wafer surfaces with OmniSpray® coating technology
- Wax and epoxy coating for subsequent bonding processes
- Spin-On-Glass (SOG) coating
- CoverSpin™ Technology
- Nozzle wash
- Edge handling
- Edge bead removal
- Backside rinse function
- Heated chuck for spray coating
Technical Data
| Available modules |
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| Spin coat / OmniSpray® / develop |
| Dispense options |
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| Various resist despense pumps to cover a wide range of viscosities up to 52000 cP |
| Liquid priming / pre-wet / bowl wash |
| Edge bead removal (EBR) / back-side rinse (BSR) |
| Constant pressure dispense systems / syringe dispense system |
| Smart process control & data analysis features (framework SW platform) |
|---|
| Integrated analysis features for process and machine control |
| Parallel task / queueing task processing feature |
| Equipment and process performance tracking feature |
| Smart handling features |
| Occurences & alarms analysis / smart maintenance management & tracking |
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm |
| Spin coat module - spinner parameter |
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| Spin speed: up to 10 k rpm |
| Acceleration speed: up to 10 k rpm |
| Spray coat module - spray generation |
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| Ultrasonic atomization nozzle / high-viscosity nozzle |
| Develop module - dispense options |
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| Puddle development / spray development |
| Additional module options |
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| Pre-alignment: mechanical |
| System control |
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| Operations system: Windows |
| File sharing & back-up solution / unlimited no. recipes & parameters / offline recipe editor |
| Flexible process flow definition / easy drag and drop recipe programming |
| Parallel processing of multiple jobs / real-time remote access, diagnostics & troubleshooting |
| Multi-language user GUI & support: CN, DE, FR, IT, JP, KR |
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