EVG^®40 D2W

The EVG®40 D2W system is the first dedicated die-to-wafer overlay metrology platform to provide 100 percent die overlay measurement with high precision and speeds needed for high volume production environments.
The EVG40 D2W system is EVG’s cutting-edge metrology tool for die-to-wafer alignment verification after bonding. It is designed to meet the stringent overlay accuracy requirements of heterogeneous integration and advanced packaging processes. This tool offers high-resolution die-to-wafer overlay measurements at the highest throughput. In contrast to other measurement methods, where only a fraction of the dies are measured, the EVG40 D2W enables 100 percent inspection for improved process control and yield in high-volume manufacturing (HVM). 
Leveraging state-of-the-art optics and image processing algorithms, the EVG40 D2W delivers overlay measurement capabilities supporting a broad range of distinctive alignment mark layouts and locations, laterally with side-by-side fiducials and vertically enabled by dual focus optics. 
Supporting a wide range of advanced packaging technologies such as fan-out wafer-level packaging (FOWLP), 2.5D/3D integration, and chiplet-based architectures, the EVG40 D2W empowers engineers with the insights needed to ensure alignment excellence and process reliability.