EVG®150

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JA 日本語 (JA)

The EVG^®150 is a fully- automated resist processing system providing high-throughput performance and supporting wafers up to 300 mm in diameter.

Designed as a fully modular platform, the EVG150 allows automated spray/spin/develop processes and high-throughput performance. The EVG150 guarantees highly uniform coats and improved repeatability. Wafers with high topography can be uniformly coated by EVG’s OmniSpraytechnology, where traditional spin coating encounters limitations.

Features

Wafer sizes up to 300 mm
Up to six process modules
Customizable number - up to twenty bake/chill/vapor prime stacks
Up to four FOUP load ports or cassette loading
Available modules include Spin Coat, Spray Coat, NanoCoat™, Develop, Bake/Chill/Vapor/Prime
EV Group’s proprietary OmniSpray^® ultrasonic atomization technology provides unmatched process results when it comes to conformal coating of extreme topographies
Optional NanoSpray™ module achieves conformal coating of 300-micron deep patterns with aspect ratios up to 1:10 and vertical sidewalls
Extensive range of supported materials
Bake modules for up to 250 °C
Megasonic technology for cleaning, sono-chemical processing and developing improves process efficiency and lowers the process time from hours to minutes
Sophisticated and field-proven robot handling with dual end-effector capability ensures continuous high throughput
Handling of thick or ultra-thin, fragile, bowed or small-diameter wafers
Versatile combinations of multi-functional modules for spin and spray coating, developing, bake and chill provide great opportunities in many fields of application
EFEM (Equipment Frontend Module) and optional FSS (FOUP Storage System)
Process technology excellence and development service
Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
Smart process control and data analysis feature [Framework SW Platform]
- Integrated analysis features for process and machine control
- Equipment and process performance tracking feature
- Parallel/queueing task processing feature
- Smart handling features
- Occurrence and alarm analysis
- Smart maintenance management and tracking

Technical Data

Number of modules
Process modules: up to 6
Bake / chill modules: up to 20

Industrial automation features
Ergo load cassette stations / SMIF loadports / SECS/GEM / FOUP load ports

Smart process control & data analysis features (framework SW platform)
Integrated analysis features for process and machine control
Parallel task / queueing task processing feature
Equipment and process performance tracking feature
Smart handling features
Occurences & alarms analysis / smart maintenance management & tracking

Wafer diameter (substrate size)
Up to 300 mm

Available modules
Spin coat / OmniSpray^® / develop
Bake / chill

Wafer handling options
Single/double EE / edge handling / wafer flipping
Bowed / warped / thin wafer handling

Dispense options
Various resist despense pumps to cover a wide range of viscosities up to 52000 cP
Liquid priming / pre-wet / bowl wash
Edge bead removal (EBR) / back-side rinse (BSR)
Constant pressure dispense systems / syringe dispense system

Resist dispense pump features flowmonitoring
Programmable dispense rate / programmable volume / programmable suck-back
Ultrasonic

Additional module options
Pre-alignment: optical / mechanical
ID-reader: barcode, alpha-numeric, data matrix

System control
Operations system: Windows
File sharing & back-up solution / unlimited no. recipes & parameters / offline recipe editor
Flexible process flow definition / easy drag and drop recipe programming
Parallel processing of multiple jobs / real-time remote access, diagnostics & troubleshooting
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR