The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops.
Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.
|Wafer diameter (substrate size)|
|Up to 300 mm, oversized carrier possible|
|Different substrate / carrier combinations|
|Bake module with multiple hot plates|
|Align module with optical or mechanical alignment|
|High topography wafer handling|
|Warped wafer handling|