Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.
|Wafer diameter (substrate size)|
|Up to 300 mm|
|Up to 12“ film frame|
|Film frame mounter|
|Various output formats|
|High topography wafer handling|
|Warped wafer handling|