Our products, which include lithography, bonding, nanoimprint and metrology systems, play an essential role in enabling today’s leading device makers to develop and manufacture tomorrow’s technology innovations.
EVG holds the dominant market share for all types of wafer bonding equipment and is a technology leader in lithography for advanced packaging and nanotechnology. Our metrology systems are optimized to ensure the tightest process control and highest yields for our industry-leading process equipment.
EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners and the in-house process knowledge of its resist processing systems.
EVG is the market-leading supplier of nanoimprint lithography (NIL) equipment and integration processes. EVG pioneered and mastered NIL from a research approach more than 15 years ago, to implementation in volume production on various substrate sizes from 2-inch compound semiconductor wafers to 300 mm wafers and even on large-area panels.
With our long-term experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding.
EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.