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EV Group Unveils Hybrid Die-to-Wafer Bonding Activation Solution to Speed Up Deployment of 3D Heterogeneous Integration

Maskless Lithography

EV Group 通过 LITHOSCALE<sup>®</sup> 技术实现无掩膜光刻技术在批量生产中的运用

EVG Academy

EV Group establishes state-of-the-art customer training facility at corporate headquarters

EVG in the Press

EVG's MLE technology takes over where traditional lithography meets its limits. Read more in our article "Maskless lithography and the shift to 3D integration" in the May/June edition of Chip Scale Review

发明-创新-实施

Triple i 理念

我们的Triple i理念体现在整个公司对技术的热情、创新实力和国际化。我们的愿景是“率先探索新技术，为微纳米制造技术的下一代应用服务”，这使我们的客户能够成功地将他们的新产品理念商业化。

我们的产品

用于大规模制造微电子和纳米电子产品行业领先的晶圆加工设备

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我们的技术

解决关键光刻、晶圆键合和量测要求的核心技术和工艺技术

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29.01.2021

ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration

ASM Pacific Technology and EV Group are joining forces to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Shown here are individual dies on a wafer after collective D2W bonding.

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19.01.2021

EV Group Establishes State-of-the-Art Customer Training Facility at Corporate Headquarters

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10.12.2020