Visit our Booth S9 & listen to our talks "High–Resolution Patterning by Maskless Exposure Technology contributing to Traceability Efforts in Semiconductors" held by Dr. Varga Ksenija and "Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Advanced Interconnects" held by Dr. Dragoi Viorel.
Visit our booth #16 & Listen to our talk "Wafer Bonding as Next Generation Scaling Booster" held by our Executive Technology Director Lindner Paul on 12 Dec, 2:15 PM as well as the AMAT IEDM Logic Panel on 12 Dec, 06:20 PM at Hotel Nikko!
Visit our Booth #5839!