事件

9th International Workshop on Low Temperature Bonding for 3D Integration LTB-3D 2026

Listen to our talk “Xenon vs Argon Ion Activation for Room‑Temperature Wafer Bonding of Si and SiC” held by Senior Process Technology Engineer Peter Kerepesi.

More information here.

ITF World 2026

Visit our booth at ITF World 2026!

ECTC 2026

Visit our booth #220 and visit our PDC "Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Heterogeneous Integration and Advanced Packaging" on Tue, May, 26 and listen as well to our talk “Digital Lithography Patterning of Novel Dry Film Resists for High Aspect Ratio Cu Pillar Applications on 310x310mm2 Panel Substrates” held by Business Development Manager Dr. Ksenija Varga on 29th of May. 

Here you'll find more information on the program.

NIL Industrial Day 2026

Visit our Booth and listen to our talk "Scaling Photonic Packaging: The Role of UV Nanoimprint Lithography” held by Senior Process Technology Engineer Patrick Schuster.

For more information follow the link.  

Tech Day Taiwan 2026

Be part of the EVG Technology Day in Hsinchu 2026 and experience the Advanced Process Technologies for the AI Era.

For Registration pls click here.

Registration Deadline: 29th May.

Leti Innovation Days 2026

Visit us at our booth at the Leti Innovation Days 2026!