To complete EVG’s lithography and bonding portfolio, sufficient metrology is necessary to ensure process control and (in combination with feedback loops) also allow for process parameter optimization like bond alignment. Versatile measurement options are available to meet the metrology requirements for a wide variety of applications. These tools can fit in HVM and R&D environments.
Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. Advanced packaging, MEMS and photonic applications are gaining importance, very often lacking suitable metrology solutions for essential processing steps. Furthermore, overall performance of the device is determined by packaging and back-end-of-line processes; hence, process requirements are getting tighter and need further metrology. EVG’s metrology solutions for wafer inspection and evaluation are optimized for lithography and all types of bonding applications. As one example, metrology prior to non-reworkable processes like wafer thinning after temporary bonding directly leads to increased yield and process security, where an integrated feedback loop results in a reduction of high-cost wafer scrap.
Visit us at booth #5751 at SEMICON West 2025!
Visit our booth and listen to our talk “Combining Inkjet Printing and Nanoimprint Lithography for Nanopatterning with Uniform Residual Layer Thickness” held by Senior Process Technology Engineer Patrick Schuster.
Visit our booth and listen to our talks “From Experimental to Essential: NIL’s Evolution in Industry” held by Corporate Technology Director Thomas Glinsner and “From Coffee Rings to Slopes: Solid Content Effects in Inkjet Coating for NIL” held by Johanna Rimböck.
Contact the EVG experts