Temporary Bonding and Debonding
Temporary bonding and debonding enabling backside processing for 3D integration
Introduction
Temporary bonding is an essential process for enabling wafer thinning and for supporting thin-wafer transfer. This is key for advanced packaging, including 2.5D, 3D IC and Fan-out Wafer-level Packaging (FoWLP) wafers, for power devices, as well as for handling fragile substrates like compound semiconductors and MEMS wafers. EVG’s outstanding wafer bonding know-how includes temporary bonding and debonding equipment, which EVG has been providing to leading fabs, foundries and packaging companies since 2001.
EVG’s most recent innovations in debonding technologies are UV and IR laser debonding, with a wide process window and LowTemp debonding for smooth process integration, enabling the production of ultra-thin chips and packages for next-generation devices. These debonding technologies complement EVG’s thermal slide-off debonding, which was the first debonding technology implemented in HVM production for advanced packaging.
EVG’s open adhesive platform, that supports all commercially available adhesive materials in combination with the different debonding technologies, enables tailored solutions for a wide range of applications with special requirements.
- Thermal slide-off debonding utilizes the softening of thermoplastic adhesives at elevated temperatures to separate the device wafer from the carrier.
- UV laser debonding separates the device wafer and the UV transparent carrier wafer by decomposing the UV laser release layer without risking the device wafers’ integrity.
- IR laser debonding (LayerRelease) is compatible with silicon carrier wafers with an inorganic IR laser release layer, which is cleanable with inorganic solvents.
Features
- Open adhesive platform
- Thermal Slide-Off, UV Laser or IR Layer Release Debonding
- Modular tool layout for throughput optimization
- Bridge capability for different substrate sizes
- Available with multiple load port options and combinations
- Film Frame, stand-alone wafer, or thin-wafer carrier as output options
- Integrated metrology enables feedback loop for high-yield processes in automated tools
- Software monitoring of the whole process for equipment performance tracking
- Fully integrated SECS/GEM interface in automated tool
Related products
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Events
Semicon India 2025
Visit our booth 1520!
SEMICON Taiwan 2025
Visit our booth #L0316 and listen to our talks at the Heterogeneous Integration Global Summit on Friday 12th Sep, 14:10 with the title: “Fusion and Hybrid Wafer Bonding: The Past, The Present, and the Future” held by Team Leader Business Development Dr. Bernd Dielacher and at the TechXPOT at 13:00 with the title “Digital Lithography LITHOSCALE® Accomplishes Patterning of High-Resolution Novel Resists and Dielectric Materials for Next Generation AI and HPC Devices” held by Corinth Kuo.
MNE 2025
Visit us at our booth & listen to our talk “Advanced Patterning For Smart Optical Devices: Integrating Inkjet Coating with Nanoimprinting for Precise Height Control and Minimal Residual Layers” held by Business Development Manager Andrea Kronawitter!
Questions about our technologies?
Contact the EVG experts