Events
WaferBond 2025
Visit EVG's booth at The International Conference on Wafer Bonding and listen to our talks:
"Impact of Surface Condition on In-Plane Distortion in Si Wafer Bonding: Correlation with Adhesion Energy and Bondwave Propagation Speed" by Technology Development Dr. Christoph Flötgen.
“Advanced IR Laser Debonding on Silicon Wafers for RDL- first FOWLP” by Supervisor Process Technology Peter Urban.
“D2W Bonding of III-V and piezo electrical materials for Heterogeneous Integration” by Team Leader Process Technology Mariana Pires.
“Comprehensive Bond strength optimization of LiTaO3 bonding using ComBond Technology” by Supervisor Process Technology Michael Dornetshumer.
“ComBond Bonding of Diamond and other Materials for Advanced Thermal Management” by Senior Process Technology Engineer Matthias Danner.
and visit the Poster Presentation, where we present following topic:
“Comparative Analysis of Atmospheric and ComBond-Activated TiTi thermos-compression Bonding” by Team Leader Process Technology Thomas Stöttinger.
EPTC 2025
Visit our Booth #20 & listen to our talks:
"The Critical Role of Wafer Bonding in Next-Generation Interconnect Scaling" held by Team Leader Business Development Dr. Bernd Dielacher and
“Innovation and Efficiency in 3D Packaging Enabled by Optimized Integration Processes ” by Business Development Manager Dr. Ksenija Varga.
SEMICON Japan 2025
Visit our Booth #E5237!