
Visit EVG at booth #505
Meet EVG at booth #3387 at SEMICON China 2026 and listen to our talk “Enabling New Integration Flows Through Wafer Bonding and Advanced Carrier Solutions for Next Gen AI Devices” held by Business Development Manager Dr. Ksenija Varga at the Heterogeneous Integration (Advanced Packaging) International Conference.

Listen to our talks:
“Hybrid Bonding and Interconnect Scaling: Driving Application Performance, Power and Cost by Mixing and Matching Semiconductor Technologies” by Representative Director Hiroshi Yamamoto.
“A predictive model for bond strengthening based on ion characteristics and the interface evolution in plasma activated fusion and hybrid bonding” by Deputy Team Leader Process Technology David Doppelbauer.
“From Scaling to Stacking: How Fusion and Hybrid Bonding enable Next-Generation High Performance Chip Architectures” by Business Development Manager Thomas Pleschke.
For more information click here.

Listen to our talk “Enabling Scalable Photonic Packaging using Nanoimprint Lithography” held by Business Development Manager Andrea Kronawitter.
More information here.

Visit us at our booth at the CS / PIC and PE International Conference and listen to our talks:
"High performance GaN power devices enabled by wafer bonding" held by Business Development Manager Elisabeth Brandl at the CS Conference.
"Advancing Photonic Packaging and Integration Through UV Nanoimprint Lithography" held by Business Development Manager Thomas Achleitner at the PIC Conference.
Visit our booth #1126!

Visit our booth #220 and visit our PDC "Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Heterogeneous Integration and Advanced Packaging" on Tue, May, 26 and listen as well to our talk “Digital Lithography Patterning of Novel Dry Film Resists for High Aspect Ratio Cu Pillar Applications on 310x310mm2 Panel Substrates” held by Business Development Manager Dr. Ksenija Varga on 29th of May.
Here you'll find more information on the program.