Events

ECTC 2026

Visit our booth #220 and visit our PDC "Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Heterogeneous Integration and Advanced Packaging" on Tue, May, 26 and listen as well to our talk “Digital Lithography Patterning of Novel Dry Film Resists for High Aspect Ratio Cu Pillar Applications on 310x310mm2 Panel Substrates” held by Business Development Manager Dr. Ksenija Varga on 29th of May. 

Here you'll find more information on the program.

NIL Industrial Day 2026

Visit our Booth and listen to our talk "Scaling Photonic Packaging: The Role of UV Nanoimprint Lithography” held by Senior Process Technology Engineer Patrick Schuster.

For more information follow the link.  

Tech Day Taiwan 2026

Be part of the EVG Technology Day in Hsinchu 2026 and experience the Advanced Process Technologies for the AI Era.

For Registration pls click here.

Registration Deadline: 29th May.

EMLC 2026

Listen to our talks on Wednesday June 22th in Session 4:

"Enhancing SWIR Device Fabrication Through Digital Lithography with Novel IR-Pass Resists" held by Business Development Manager Dr. Ksenija Varga and

"Challenges and Solutions for Flexible, Scalable, High-Throughput Digital" held by Senior Optical Systems Expert Dr. Boris Považay.

Leti Innovation Days 2026

Visit us at our booth at the Leti Innovation Days 2026!