Visit our booth #C1311 at SEMICON EUROPA 2024 & listen to our talks:
"Challenges of new chiplet integration – how organic interposers challenge BEOL equipment" held by Brandl Elisabeth on November 13rd, 10:05 at the Advanced Packaging Conference.
"Latest Innovations in MEMS Wafer Bonding" held by Dr. Uhrmann Thomas on November 14th, 12:10 at the MEMS & Imaging Sensors Summit!
We would also be delighted to see you at our Happy Hour on 13th of Nov 4PM-6PM at our booth!
Visit our Booth #2 & listen to our talk
"Advantages of Digital Lithography in Patterning of UHD FoWLP Utilizing Novel PI Dielectrics" held by Dr. Varga Ksenija and join the PDC for Wafer Bonding for Advanced Packaging Applications with Dr. Viorel Dragoi.
Wednesday, Dec 04, 2024
Visit our Booth #5339!