Events

SEMI ISS 2026

Listen to our talk “Wafer Bonding: A Cornerstone of Future Semiconductor Architectures” held by Executive Technology Director Paul Lindner.

12.01. - 14.01.2026

Half Moon, CA, United States

SPIE | AR | VR | MR 2026

Visit our booth #6426 and listen to our talks: "Advances in Dual-Side NIL: Alignment Accuracy and First-Side Protection for AR Applications" held by Business Development Manager Thomas Achleitner and in the Manufacturing Session from Dr. Thomas Glinsner .

20.01. - 22.01.2026

San Francisco, United States

IEEE Hybrid Bonding Symposium

Listen to our talk “Wafer-to-wafer Bonding Overlay: Co-Optimization with Lithography and Hidden Patterns” held by Business Development Manager Dr. Anton Alexeev.

22.01. - 23.01.2026

Silicon Valley, CA, United States

Semicon Korea

Visit our booth #C740 and listen to our talks “EVG LayerRelease Technology ; Key Innovations in Carrier Systems: Addressing D2W and W2W Stacking Requirements” held by Corporate Sales & Marketing Director Dr. Thomas Uhrmann and “High Throughput Digital Lithography Development Enables AI and HPC Device Integration” by Business Development Manager Dr. Ksenija Varga.

11.02. - 13.02.2026

Seoul, Korea

SPIE Advanced Lithography & Patterning 2026

Visit our booth #616 and listen to our talks

on February 25th: “High aspect ratio copper pillar structures enabled by digital lithography patterning of thick resists for AI and HPC device packages” presented by Dr. Ksenija Varga.

on February 26th:"Ultrasonic spray coating combined with maskless lithography for advanced wafer singulation with complex bump geometries" held by Johanna Rimböck and “Lithography Digitalization in Semiconductor Technologies Through Advanced Software Development of High Throughput Maskless Exposure” held by Alois Malzer.

22.02. - 26.02.2026

San Jose, USA