Listen to our presentation "Metal/Dielectric Hybrid Bonding for Heterogenous Integration Applications" held by Dr. Viorel Dragoi.
Visit our booth #L0316 & listen to our talks:
"Disruptive 3D Integration Technologies for Advanced Stacked Systems" at the HIGS Summit and "Maskless Patterning Solution for multi-functional chiplets in advanced System-in-Package (SiP)" at the TechXSpot.