Events

Semicon Korea

Visit our booth #DS26 and listen to our talks “EVG LayerRelease Technology ; Key Innovations in Carrier Systems: Addressing D2W and W2W Stacking Requirements” held by Corporate Sales & Marketing Director Dr. Thomas Uhrmann and “High Throughput Digital Lithography Development Enables AI and HPC Device Integration” by Business Development Manager Dr. Ksenija Varga.

SPIE Advanced Lithography & Patterning 2026

Visit our booth #616 and listen to our talks

on February 25th: “High aspect ratio copper pillar structures enabled by digital lithography patterning of thick resists for AI and HPC device packages” presented  by Dr. Ksenija Varga.

on February 26th:"Ultrasonic spray coating combined with maskless lithography for advanced wafer singulation with complex bump geometries" held by Johanna Rimböck and “Lithography Digitalization in Semiconductor Technologies Through Advanced Software Development of High Throughput Maskless Exposure” held by Alois Malzer.

IMAPS Device Packaging 2026

Visit EVG at booth #505

SEMICON China 2026

Meet EVG at booth #3387 at SEMICON China 2026 and listen to our talk “Enabling New Integration Flows Through Wafer Bonding and Advanced Carrier Solutions for Next Gen AI Devices” held by Business Development Manager Dr. Ksenija Varga at the Heterogeneous Integration (Advanced Packaging) International Conference.

ICEP-HBS 2026

Listen to our talks “Hybrid Bonding and Interconnect Scaling: Driving Application Performance, Power and Cost by Mixing and Matching Semiconductor Technologies” and “From Scaling to Stacking: How Fusion and Hybrid Bonding enable Next-Generation High Performance Chip Architectures”.

For more information click here.

Merck "The Future of Photonics — Materials Matter"

Listen to our talk “Enabling Scalable Photonic Packaging using Nanoimprint Lithography” held by Business Development Manager Andrea Kronawitter.

More information here.

Semicon South East Asia 2026

Visit our booth #1126!

ECTC 2026

Visit our booth #220 and visit our PDC "Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Heterogeneous Integration and Advanced Packaging" on Tue, May, 26 and listen as well to our talk “Digital Lithography Patterning of Novel Dry Film Resists for High Aspect Ratio Cu Pillar Applications on 310x310mm2 Panel Substrates” held by Business Development Manager Dr. Ksenija Varga on 29th of May. 

Here you'll find more information on the program.