For nearly 40 years, EVG has provided industry-leading process technologies and solutions that have enabled innovations in advanced packaging, optics and photonics, sensors and bio-medical devices and applications.
True to our Triple-i philosophy of “Invent”, “Innovate” and “Implement”, our core lithography, wafer bonding and metrology technologies enable manufacturers to develop the latest micro- and nanotechnology device breakthroughs, and then bring them into high-volume production, cost effectively and at high process yields.
Moving beyond traditional mask-based lithoghraphy toward digital lithography technology
A large-area soft UV-nanoimprint lithography process for high-volume manufacturing
Market-leading WLO manufacturing portfolio, including step-and-repeat mastering, lens molding, nanoimprint lithography and stacking
The most complete technology portfolio, supporting a maximum range of requirements in optical lithography
Resist processing technology together with patterning are the most repeated steps in semiconductor manufacturing
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking
Temporary bonding and debonding enabling backside processing for 3D integration
Low-temperature metal wafer bonding by Transient Liquid Phase (TLP)
Fusion and Hybrid Bonding for engineered substrates and 3D device integration
A breakthrough technology driving the bonding of “anything on anything” enabling emerging and “beyond CMOS” device designs