EVG®770 NT enables large-area master stamp fabrication of complex micro- and nano-structures for augmented reality waveguides, wafer-level optics and advanced biomedical chips

invent – innovate – implement

Triple i philosophy

Our Triple i philosophy is reflected in the enthusiasm for technology, innovative strength and internationality of the entire company. Our vison of “being the first in exploring new techniques and serving next-generation applications of micro- and nanofabrication technologies” enables our customers to successfully commercialize their new product ideas.

Join our Insider team at EVG and shape the future with us!


  • More than 1000 employees worldwide
  • 850+ employees at EVG headquarters
  • Centralized development and production 
  • Global process technology teams
Installed Base
  • Systems in high volume production and R&D
  • 24/7 operation in semiconductor fabs worldwide  
  • Dominant market share in wafer bonding 
  • Multiple customer satisfaction awards
EVG Sites and Locations
  • Global headquarters in Austria
  • Eight fully owned subsidiaries in major markets
  • Local representatives in many other countries
  • Worldwide customer support network

Global Presence