EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT

Maskless Exposure Technology – Ideal Patterning Solution for Heterogeneous Integration

Heterogeneous integration—the manufacturing, vertical assembly and packaging of multiple different dies into a single package—has led to greater package complexity, as well as a greater number of package options available. This in turn is driving the need for greater design flexibility and the ability to adopt both die-level and wafer-level designs simultaneously in back-end lithography. Accurate reconstitution of wafers is a key parameter in integrating dies from various wafer fabs or fab lines in multi-die solutions. Steppers and other mask-based patterning systems struggle to cope with inaccuracies from die-placement and die-shift variations caused by over-molding. In addition, the reticle size and optics dimensions of static exposure systems limit the exposure area. This is particularly challenging in large die interposer fabrications, where stitch-lines and/or mismatches overlap regions of the reticle exposure field, which can affect the electrical properties within the redistribution layer (RDL). The ability to generate a homogenous pattern for interposers that exceed current reticle size is crucial for devices with complex designs, such as those used in advanced graphic processing, 5G, AI and HPC.

EVG MLE Technology Advantages

LITHOSCALE XT tackles legacy bottlenecks associated with steppers by combining powerful digital processing that enables real-time data transfer and immediate exposure, with high structuring resolution and high throughput. Key features include:

• Up to six exposure heads to cover a 300-mm wafer or 300-mm x 300-mm panel substrate in a parallel exposure process
• High-resolution (down to sub-2-micron lines/spaces), stitch-free, full-wafer patterning with no field-exposure or die-size limitations
• Simple switching between mask layouts, supporting multi-die patterning without the associated high cost of ownership for having many masks
• Real-time wafer-level distortion and die-shift compensation for bowed or warped wafers, enabling improved die-placement accuracy and patterning yield without impact on throughput
• Supports a wide range of exposure applications thanks to a dual-wavelength laser source (e.g., thin and thick photoresists, <1 micron up to >100 microns in thickness, chemically amplified resists, positive and negative tone, dielectrics, high-aspect-ratio patterning, etc.)

According to Dr. Bernhard Thallner, pathfinding and optics director at EV Group, “The adoption and evolution of heterogeneous integration is driving tighter performance requirements for back-end lithography that can no longer be fully met with traditional mask-based solutions like steppers and mask aligners. While the technical advantages of MLE technology are abundantly clear, throughput has been a barrier to HVM adoption until now. Our newest MLE platform, LITHOSCALE XT, supports our customers’ unique patterning needs in HVM, not only for advanced packaging but also numerous other applications that can benefit from its combination of high versatility, resolution and throughput. We are ready to engage with customers and partners to help them leverage the myriad benefits of our MLE technology for their respective unique manufacturing needs.”

Automotive, Security and Imaging Benefits from EVG MLE Technology

In addition to advanced packaging, LITHOSCALE XT is also ideal for use in the manufacture of advanced image sensors—which involve complex shapes and highly functional optical materials that present challenges to stepper technologies—thanks to its high resolution and excellent sidewall profile performance on structures with complex shapes and/or high aspect ratios. LITHOSCALE XT’s Dynamic Die Annotation capability also enables on-the-fly generation of unique die identifiers for each individual wafer, supporting industry standards for individual die identification and traceability—such as SEMI E142 and SEMI T23—that are designed to meet the needs of the highly demanding security and automotive markets.

See EVG at ECTC 2025

Attendees at the 2025 IEEE 75^th Electronic Components and Technology Conference (ECTC) interested in learning more about the LITHOSCALE XT and other innovative process solutions from EVG that are enabling advances in AI, HPC, advanced packaging, and sustainable semiconductor manufacturing, are invited to visit EVG at Booth #330 on May 27-30 in Dallas, Texas. In addition, Dr. Ksenija Varga, business development manager for EV Group, will unveil the latest results from EVG’s MLE technology in her oral presentation “Advanced FO PLP Digital Lithography Patterning Development for AI Devices” (co-authored with Fujifilm Electronic Materials) in Session 21 on Thursday, May 29 at 2:40pm in Room Texas 4-6.

Product Availability

EVG is now accepting orders for the LITHOSCALE XT maskless exposure system, and is offering product demonstrations at EVG’s headquarters. For more information, please visit https://www.evgroup.com/products/lithography/lithoscale-maskless-exposure-lithography-systems/lithoscale-xt

About EV Group (EVG)

EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes. The company’s vision of being the first in exploring new techniques and supporting next-generation applications of micro- and nanofabrication technologies enables customers to successfully commercialize new product ideas. EVG’s high-volume-manufacturing-ready products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications. More information about EVG is available at www.EVGroup.com.

Contacts:

Clemens Schütte
Director, Marketing and Communications
EV Group
Tel: +43 7712 5311 0
E-mail: Marketing@EVGroup.com

David Moreno
Principal
Open Sky Communications
Tel: +1.415.519.3915
E-mail: dmoreno@openskypr.com