Temporary bonding is an essential process for enabling wafer thinning and for supporting thin-wafer transfer. This is key for advanced packaging, including 2.5D, 3D IC and Fan-out Wafer-level Packaging (FoWLP) wafers, for power devices, as well as for handling fragile substrates like compound semiconductors and MEMS wafers. EVG’s outstanding wafer bonding know-how includes temporary bonding and debonding equipment, which EVG has been providing to leading fabs, foundries and packaging companies since 2001.
EVG’s most recent innovations in debonding technologies are UV and IR laser debonding, with a wide process window and LowTemp debonding for smooth process integration, enabling the production of ultra-thin chips and packages for next-generation devices. These debonding technologies complement EVG’s thermal slide-off debonding, which was the first debonding technology implemented in HVM production for advanced packaging.
EVG’s open adhesive platform, that supports all commercially available adhesive materials in combination with the different debonding technologies, enables tailored solutions for a wide range of applications with special requirements.
Besuchen Sie unseren Stand auf dem MicroNanoFabrication Annual Review Meeting 2025!
Besuchen Sie unseren Stand #L1300!
Besuchen Sie unseren Stand #330 und unser PDC „Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Advanced Interconnects“ von Dr. Viorel Dragoi am 27. Mai und hören Sie sich auch unsere Vorträge „Advanced FO PLP Digital Lithography Patterning Development for AI Devices“ & „Wafer-to-Wafer Bonding With Saddle-Shaped Wafers“ von Dr. Ksenija Varga und Anton Alexeev am 29. Mai an. Wir freuen uns auch darauf, Sie bei der Poster Session am 29. Mai zu treffen, wo Urban Peter „IR Laser Debonding for Silicon Based Temporary Carrier Systems Enabling 2.5D and 3D Chiplet Integration Processes“ präsentieren wird.
Kontaktieren Sie die EVG-Experten