Temporary bonding is an essential process for enabling wafer thinning and for supporting thin-wafer transfer. This is key for advanced packaging, including 2.5D, 3D IC and Fan-out Wafer-level Packaging (FoWLP) wafers, for power devices, as well as for handling fragile substrates like compound semiconductors and MEMS wafers. EVG’s outstanding wafer bonding know-how includes temporary bonding and debonding equipment, which EVG has been providing to leading fabs, foundries and packaging companies since 2001.
EVG’s most recent innovations in debonding technologies are UV and IR laser debonding, with a wide process window and LowTemp debonding for smooth process integration, enabling the production of ultra-thin chips and packages for next-generation devices. These debonding technologies complement EVG’s thermal slide-off debonding, which was the first debonding technology implemented in HVM production for advanced packaging.
EVG’s open adhesive platform, that supports all commercially available adhesive materials in combination with the different debonding technologies, enables tailored solutions for a wide range of applications with special requirements.
Hören Sie sich unsere Vorträge am Mittwoch 18. Juni in Session 15 an:
„Investigation of influence of structure geometry on resist coverage for spray coating“ von Johanna Rimböck, Technology Development und
„Utilizing Inkjet Coating and Nanoimprinting for Complex 3D Patterns with Gradual Height Increase and Minimal Residual Layer“, gehalten von Business Development Manager Thomas Achleitner.
Besuchen Sie unseren Stand bei den Leti Innovation Days 2025!
Besuchen Sie unseren Stand B1.141!
Kontaktieren Sie die EVG-Experten