EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners and its newly developed, revolutionary and highly versatile maskless exposure lithography systems. These capabilities are complemented by its resist coating and resist development systems with advanced in-house process competences and hands-on development skills.
Most of EVG’s lithography equipment platforms are 300-mm ready, can be fully integrated into EVG’s HERCULES® lithography track systems, and are complemented by its metrology tools for top-to-bottom-side alignment verification.
EVG constantly looks ahead to future market trends and thus provides application-specific solutions, particularly in advanced packaging, MEMS, compound semiconductors, photonics and biomedical markets where EVG’s process and materials expertise – derived from extensive research with a wide range of resist materials – is unsurpassed. Understanding customer needs and providing efficient worldwide support are important ingredients in the success of EVG’s lithography solutions.
Accommodating wafers and substrates up to 300 mm, varying in size, shape and thickness, EVG’s mask alignment systems aim to provide sophisticated solutions with a high grade of automation for advanced applications and full flexibility for research and development.
Maskless exposure lithography systems represent an entirely new platform of EVG lithography equipment. The world’s first highly scalable maskless lithography technology for high-volume manufacturing, MLE delivers unsurpassed flexibility to enable extremely short development cycles for new devices.
The EVG100 series resist processing systems establish new standards in quality and flexibility for photoresist coating and developing.