Resist Processing

Important advancements by EV Group in lithography technology include proprietary resist coating technologies, such as OmniSpray, revolutionary NanoSpray and NanoFill. These unique technologies are implemented in the EVG100 series of resist processing systems and establish new standards in quality and flexibility for photoresist coating and developing. Designed to support a wide range of process parameters and customer requirements, an extensive range of materials – such as positive and negative resists, polyimides, double-sided coating of thin-resist layers, high-viscosity resists, and edge-protection coatings – can be processed on the EVG100 series. While the importance of resist processing to enable certain process flows is often underestimated and just considered a commodity for standard lithography processes, in many cases it is the key enabling process. For example, patterning on high-topography wafers, LIGA (lithography, electroforming, and molding), temporary bonding, nanoimprint lithography (NIL) and adhesive bonding all rely on advanced coating capabilities and process excellence. EVG has built up many years of spin and spray coating experience for demanding applications and incorporates these learnings into the EVG100 series, where our process know-how can be leveraged to support our customers. As with all EVG processing systems, the equipment can be configured for R&D environments or for high-volume production.

• Wafer sizes supported up to 300 mm
• Coating of up to 52,000 cP enables manufacturing of ultra-thick resist features of up to 300 µm with an extensive range of supported materials
• Available modules
  • Spin coat module with a simulation-based low-turbulence design
  • OmniSpray^® coating for optimized coating of high-topography surfaces
  • NanoSpray™/NanoFill™ for coating/filling and protection of via structures
  • Develop
  • Bake
  • Chill
  • Vapor
• CoverSpin™ rotating cover for low resist consumption and optimized resist coating uniformity
• EV Group's proprietary OmniSpray^® ultrasonic atomization technology provides unmatched conformal coating process results on extreme topographies
• Optional NanoSpray™ module achieves conformal coating of 300 µm deep patterns with aspect ratios up to 1:10 and vertical sidewalls
• Easy process transfer from research to production utilizing proven modular design
• Fragile, thin or warped wafer handling of multiple wafer sizes
• Smart process control and data analysis software features
  • Integrated analysis features for process and machine control
  • Parallel task/queueing task processing feature
  • Equipment and process performance tracking feature
  • Smart handling features
  • Occurrences and alarms analysis
  • Smart maintenance management and tracking
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)