Visit us at our booth & listen to our talk "Nanoimprint Lithography – Unleashing its Potential" held by Dr. Glinsner Thomas on 26th of September!
Listen to our talks:
"Inline bondwave monitoring for fusion bonding, process optimization and impact on post-bond distortion" on 10th of October 10:40 AM at Room R24 and R25, Level 2
"Surface activated Si-Si wafer bonding using different ion species" on 11th of October 09:00 AM at Room R24 and R25, Level 2
"Oxide-free SiC-SiC direct wafer bonding and its characterization" on 11th of October 11:00 AM at Room R24 and R25, Level 2
"Recent developments in low temperature wafer level metal bonding for heterogenous integration" on 12th of October 09:40 AM at Room R24 and R25, Level 2
Listen to our talk "State-Of-The-Art Wafer Bonding for HBM and Heterogenous D2W 3D Integration" held by Dr. Glinsner Thomas on October 26th, 09:50 in the Grand Ballroom A!
Listen to our talk "Cost efficient dual layer patterning concept for Fan-Out Wafer level packaging employing Maskless Lithography" held by Dr. Varga Ksenija on Ocotber 25th, 16:20 in Room R504b!
Listen to our talk "Cutting Cost and Resolution Enabled by Novel Photonic Technologies for Next–Generation Probe Cards Manufacturing" held by Dr. Varga Ksenija on November 02nd, 11:30!
Join our luncheon starting at 11:00 AM followed by poster sessions and a window tour of our lab as well as a presentation by the ASU!
Treffen Sie das EVG-Team am Stand #C1211 und besuchen Sie unsere Präsentationen auf der Electronica!
Wednesday, November 29, 2023