The HERCULES NIL, a fully integrated UV nanoimprint lithography track solution for wafers up to 200 mm, is the latest addition to EVG’s NIL product portfolio. Based on a modular platform, the HERCULES NIL combines EVG’s proprietary SmartNIL imprinting technology with cleaning, resist coating and baking pre-processing steps. This turns the HERCULES NIL into a “one stop shop”, where bare wafers are loaded into the tool and fully processed nanostructured wafers are returned.
To optimize the process chain, fabrication of multiple-use soft stamps – which are a cornerstone for high-volume production – is included in the HERCULES NIL without requiring additional imprint stamp manufacturing equipment. As a special feature, the tool can be upgraded with a ISO 3* capable mini-environment to guarantee the lowest defect rates and highest-quality master replication.
By providing a complete NIL solution for high-volume manufacturing, the HERCULES NIL strengthens EVG’s leadership position in full-area NIL equipment solutions.
*according to ISO 14644
*resolution dependent on process and template
EVG’s HERCULES NIL 300 mm is a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG’s proprietary SmartNIL large-area nanoimprint lithography (NIL) process in a single platform for wafers up to 300 mm in diameter. It is the first NIL system based on EVG’s fully modular equipment platforms with swappable modules to give customers maximum freedom to configure their systems to best meet their production needs, including bridge capabilities for 200 mm and 300 mm wafers.
The HERCULES NIL 300 mm provides the most advanced nanoimprint capabilities on the market with low force and conformal imprinting, fast high-power exposure and smooth stamp detachment. The system supports the production of a variety of devices and applications, including optical devices for augmented/virtual reality (AR/VR) headsets, 3D sensors, bio-medical devices, nanophotonics and plasmonics.
*resolution dependent on process and template
Wafer diameter (substrate size) |
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100 up to 200 mm / 200 and 300 mm |
Resolution |
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≤ 40 nm (resolution dependent upon template and process) |
Supported Process |
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SmartNIL® |
Exposure source |
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High-power LED (i-line) > 400 mW/cm² |
Alignment |
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≤ ± 3 µm |
Automated separation |
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Supported |
Pre-processing |
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All pre-processing modules available |
Mini environment and climate control |
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Optional |
Working stamp fabrication |
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Supported |