Optical lithography, the structuring of photosensitive materials by mask-defined light for subsequent semiconductor processes, is a well-known and established technology. Today’s main requirements for optical lithography are defined by several key parameters. Sub-micron alignment accuracy, controlled uniform proximity gap between mask and wafer, as well as a clearly defined and precisely controlled exposure spectrum corresponding to the resist sensitivity, are among the most important criteria taken into account. Additionally, EVG´s customer-focused approach includes customized solutions for dedicated process needs. Understanding special requirements and having the flexibility to adapt our systems accordingly are among the unique core competences that EVG brings to the marketplace while constantly enhancing its lithography portfolio.
Over the years, optical lithography has continued to evolve to meet the scaling requirements for new semiconductor device designs. EVG has also continuously looked ahead at future market requirements and developed new innovations in the field of optical lithography technology – from the invention of the world’s first double-sided mask aligner in 1985 up to today, with the IQ Aligner NT achieving a top-side alignment down to 250 nm. Furthermore, EVG has implemented many advanced alignment features, such as runout control with temperature-controlled toolset, automatic cross correction, full clearfield mask movement, edge alignment and dynamic alignment. The latest implemented technology in EVG’s mask alignment product family is UV-LED technology, which gives users much more flexibility for their applications in terms of UV exposure spectrum setup, as spectral lines are individually tunable and special optical filters are no longer required. Maintenance of UV-LED lamp houses is also minimized. Further capabilities such as bond, transmissive or reflective IR alignment, as well as EVG’s proprietary SmartNIL technology, make EVG’s mask aligners very well equipped and advanced. This technology is well-established in the worldwide market today, covering all essential steps and able to serve various applications, such as wafer bumping, creation of redistribution layer (RDL) and via etching masks, via bottom opening processes, as well as lithography performed on thin or temporary bonded wafers. Such systems can be configured in semi-automated configurations for R&D as well as fully automated system configurations running cassette-to-cassette processes for high-volume production.

Treffen Sie das EVG-Team am Stand #B1241 und besuchen Sie unsere Poster-Präsentation auf der APC:
"High Throughput Digital Lithography Development for 3D Device Integration" von Business Development Manager Dr. Ksenija Varga.

Besuchen Sie unseren Stand auf der Internationalen Wafer Bonding Konferenz und hören Sie sich unsere Talks an:
"Impact of Surface Condition on In-Plane Distortion in Si Wafer Bonding: Correlation with Adhesion Energy and Bondwave Propagation Speed" von Technology Development Dr. Christoph Flötgen.
“Advanced IR Laser Debonding on Silicon Wafers for RDL- first FOWLP” von Supervisor Process Technology Peter Urban.
“D2W Bonding of III-V and piezo electrical materials for Heterogeneous Integration” von Team Leader Process Technology Mariana Pires.
“Comprehensive Bond strength optimization of LiTaO3 bonding using ComBond Technology” von Supervisor Process Technology Michael Dornetshumer.
“ComBond Bonding of Diamond and other Materials for Advanced Thermal Management” von Senior Process Technology Engineer Matthias Danner.
und besuchen Sie die Poster Presentation, wo wir mit folgendem Thema vertreten sind:
“Comparative Analysis of Atmospheric and ComBond-Activated TiTi thermos-compression Bonding” von Team Leader Process Technology Thomas Stöttinger.

Besuchen Sie unseren Stand #20 & hören Sie sich unsere Vorträge an:
"The Critical Role of Wafer Bonding in Next-Generation Interconnect Scaling" gehalten von Team Leader Business Development Dr. Bernd Dielacher und
“Innovation and Efficiency in 3D Packaging Enabled by Optimized Integration Processes” von Business Development Manager Dr. Ksenija Varga.
Kontaktieren Sie die EVG-Experten