To complete EVG’s lithography and bonding portfolio, sufficient metrology is necessary to ensure process control and (in combination with feedback loops) also allow for process parameter optimization like bond alignment. Versatile measurement options are available to meet the metrology requirements for a wide variety of applications. These tools can fit in HVM and R&D environments.
Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. Advanced packaging, MEMS and photonic applications are gaining importance, very often lacking suitable metrology solutions for essential processing steps. Furthermore, overall performance of the device is determined by packaging and back-end-of-line processes; hence, process requirements are getting tighter and need further metrology. EVG’s metrology solutions for wafer inspection and evaluation are optimized for lithography and all types of bonding applications. As one example, metrology prior to non-reworkable processes like wafer thinning after temporary bonding directly leads to increased yield and process security, where an integrated feedback loop results in a reduction of high-cost wafer scrap.
Visit our booth 1520!
Besuchen Sie unseren Stand Nr. L0316 und hören Sie sich unsere Vorträge auf dem Heterogeneous Integration Global Summit am Freitag, den 12. September, um 14:10 Uhr mit dem Titel „Fusion und Hybrid-Wafer-Bonding: Vergangenheit, Gegenwart und Zukunft” an, gehalten von Team Leader Business Development Dr. Bernd Dielacher und beim TechXPOT um 13:00 mit dem Titel “Digital Lithography LITHOSCALE® Accomplishes Patterning of High-Resolution Novel Resists and Dielectric Materials for Next Generation AI and HPC Devices” gehalten von Corinth Kuo.
Besuchen Sie unseren Stand und hören Sie sich unseren Vortrag “Advanced Patterning For Smart Optical Devices: Integrating Inkjet Coating with Nanoimprinting for Precise Height Control and Minimal Residual Layers”, gehalten von Business Development Manager Andrea Kronawitter, an!
Kontaktieren Sie die EVG-Experten