Automated Production Wafer Bonding System

Integrated modular high-volume manufacturing system for aligned wafer bonding

A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.


  • Fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding
  • Configuration options for bottom-side or SmartView alignment
  • Multiple bonding chambers
  • Wafer handling system is separated from bond chuck handling system
  • Modular design with swap-in modules
  • Combines all benefits from EVG's precision aligners and EVG®500 series systems
  • Minimized footprint compared to stand-alone systems
  • Optional process modules:
    • LowTemp™ plasma activation
    • Wafer cleaning
    • Coat module
    • UV bond module
    • Bake/chill modules
    • Alignment verification module

Technical Data

Maximum heater size
150, 200, 300 mm
Loading chamber
5-axis robot
Max. bond modules
Max. pre-processing modules
200 mm: 4
300 mm: 6

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