EV Group产品键合Bond Alignment Systems

Bond Alignment Systems

With the invention of the world’s first double-sided alignment system in 1985, EV Group revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This separation results in higher flexibility and universal application of the wafer bonding equipment. EVG’s bond alignment systems offer the highest precision, flexibility and ease of use, and modular upgrade capability, and have been qualified in numerous high-throughput production environments. The precision of EVG bond aligners accommodates the most demanding alignment processes.

Talk to our EVG product experts!