Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
Thin wafer debonding.
Automated, stress-free lamination of any kind of dry adhesive film (tape) onto a wafer.
Fully automated temporary wafer bonding of a substrate on a rigid carrier.
Fully automated debonding, cleaning and unloading of thin wafers.