The EVG770 is a versatile platform for step-and-repeat nanoimprint lithography for efficient master fabrication or direct patterning of complex structures on substrates. This approach allows uniform replication of templates from small dies up to 50 mm x 50 mm over large areas up to 300 mm substrate sizes. In combination with diamond turning or direct writing methods, step-and-repeat imprinting is frequently used to efficiently fabricate masters required for wafer-level optics manufacturing or EVG’s SmartNIL process.
Key features of the EVG770 include precise alignment capabilities, full process control and the flexibility to address requirements of a wide variety of devices and applications.
Wafer diameter (substrate size) |
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100 up to 300 mm |
Resolution |
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≤ 50 nm (resolution dependent upon template and process) |
Supported Process |
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Soft UV-NIL |
Exposure source |
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High-power LED (i-line) > 100 mW/cm² |
Alignment |
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Top side microscope for live overlay alignment ≤ ± 500 nm and fine alignment ≤ ± 300 nm |
First print die to die placement accuracy |
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≤ 1 µm |
Active imprint area |
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Up to 50 x 50 mm |
Automated separation |
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Supported |
Pre-processing |
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Coating: droplet dispense (optional) |
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