Known for its high level of automation and reliability, the EVG620 bond alignment system is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. EV Group´s bond alignment systems offer the highest precision, flexibility and ease of use, and modular upgrade capability, and have been qualified in numerous high-throughput production environments. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
Most suitable for EVG®501, EVG®510, and EVG®520 IS bonding systems
Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes