Automated High-Vacuum Wafer Bonding System

High-vacuum wafer bonding platform facilitating covalent bonds of “anything on anything”

The EVG ComBond high-vacuum wafer bonding platform marks a new milestone in EVG’s unique portfolio of wafer bonding equipment and technology in response to market needs for more sophisticated integration processes. The application areas supported by the EVG ComBond range from advanced engineered substrates, stacked solar cells and power devices to high-end MEMS packaging, high-performance logic and “beyond CMOS” devices. The modular cluster design of the EVG ComBond system allows for a highly flexible platform that can be tailored to various demanding customer needs both in R&D and high-throughput, high-volume manufacturing environments. The EVG ComBond facilitates the bonding of heterogeneous materials with different lattice constants and coefficients of thermal expansion (CTE) as well as the formation of electrically conductive bond interfaces by its unique oxide-removal process. The EVG ComBond high-vacuum technology also enables low-temperature bonding of metals, such as aluminum, that re-oxidize quickly in ambient environments. Void-free and particle-free bond interfaces and excellent bond strength can be achieved for all material combinations.


  • High-vacuum, aligned, covalent bonding
    • Processing in high-vacuum environment (< 5·10-8 mbar)
    • In-situ sub-micron face-to-face alignment accuracy
    • High-vacuum MEMS and optical device encapsulation In-situ surface and native oxide removal
    • Superior surface properties
    • Conductive bonding
  • Room-temperature process
    • Multiple material combinations, including metals (aluminum)
    • Stress-free bond interface
    • High bond strength
  • Modular system for HVM and R&D  
    • Flexible configurations up to six modules
    • Substrate size up to 200 mm
    • Fully automated

Technical Data

Vacuum level
Handling: < 7E-8 mbar
Processing: < 5E-8 mbar
Cluster configuration
Process modules: min. 3, max. 6
Loading: manual, cassette, EFEM
Optional process modules:
Bond module
ComBond® Activation Module (CAM)
Bake module
Vacuum Alignment Module (VAM)
Wafer diameter
Up to 200 mm

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