EVG®610 BA

Bond Alignment System

Manual bond alignment system for wafer-to-wafer alignment suitable for academia and industrial research

The EVG610 bond alignment system is designed for wafer-to-wafer alignment up to 200 mm wafer sizes. EV Group´s bond alignment systems offer a manual high-precision alignment stage with bottom-side microscope. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.


  • Most suitable for EVG®501 and EVG®510 bonding systems
  • Wafer and substrate sizes up to 150 / 200 mm
  • Manual high-precision alignment stage
  • Manual-operated bottom-side microscope
  • Windows® based user interface
  • Perfect multi-user concept (unlimited number of user accounts, various access rights, different user interface languages)
  • Desktop system design with minimum footprint
  • Supports IR alignment process
  • Optimum total cost of ownership (TCO) for R&D and pilot line production

Technical Data

General system configuration
System rack: optional
Vibration isolation: passive
Alignment methods
Backside alignment: ± 2 µm 3 σ
Transparent alignment: ± 1 µm 3 σ
IR alignment: option
Alignment stage
Precision micrometers: manual
Optional: motorized micrometers
Wedge compensation: automated
Substrate / Wafer parameters
Size: 2", 3", 100 mm, 150 mm, 200 mm
Thickness: 0,1 - 10 mm
Max. stack height: 10 mm
Automatic alignment
Handling system
Standard: 2 cassette stations
Optional: up to 5 stations

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