Automated Collective Die-to-Wafer Bonding System

High volume manufacturing system for collective die-to-wafer (Co-D2W) bonding

A promising approach for hybrid D2W bonding is collective D2W (Co-D2W). In Co-D2W bonding, multiple dies are transferred to the final wafer in a single process step. The manufacturing flow for the Co-D2W bonding process consist of four major segments: carrier preparation, carrier population, wafer bonding and carrier separation. The EVG Gemini FB configured for D2W bonding is a decisive element in the Co-D2W integration flow, enabling efficient cleaning and transfer of carrier mounted dies, bonding and carrier detachment in one system. The Gemini FB system is industry standard for both wafer-to-wafer as well as Co-D2W fusion and hybrid bonding.


  • Flexible handling of wafer and customized die carriers
  • Industry standard SmartView® NT face-to-face bond aligner for carrier to device wafer alignment
  • Up to six pre-processing modules:
    • Clean module
    • LowTemp™ plasma activation module
    • Alignment verification module
    • Thermocompression bond module
  • XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)
  • Software interfaces and integrated metrology functions allowing feed-forward and feed-back loop for efficient D2W overlay optimization

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