The EVG610 Semi-automated Bond Alignment System is a flexible desktop unit targeted for R&D and small-scale production needs in MEMS/MST markets. The EVG610 contains a precision alignment stage for optical bond alignment.
Features
- Wafer and substrate sizes up to 200 mm
- Manual high precision alignment stage
- Manual operated bottom side microscope
- Windows
® based user interface
- Perfect multi user concept (unlimited number of user accounts, various access rights, different user interface languages)
- Desk top system design with minimum footprint
- Supports IR alignment process
- Optimum total cost of ownership (TCO) for R&D and pilot line production