The EVG®6200∞ BA bond alignment system offers the high precision, flexibility and ease of use in numerous production environments. The precision of EVG bond aligners accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
General system configuration |
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Desktop |
System rack: optional |
Vibration isolation: passive |
Alignment methods |
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Backside alignment: ± 2 µm 3 σ |
Transparent alignment: ± 1 µm 3 σ |
IR alignment: option |
Alignment stage |
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Precision micrometers: manual |
Optional: motorized micrometers |
Wedge compensation: automated |
Substrate / Wafer parameters |
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Size: 2", 3", 100 mm, 150 mm, 200 mm |
Thickness: 0,1 - 10 mm |
Max. stack height: 10 mm |
Automatic alignment |
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Optional |
Handling system |
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Standard: 3 cassette stations |
Optional: up to 5 stations |
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