The SmartView NT automated bond alignment system for universal alignment offers a proprietary method for micron-level face-to-face wafer-level alignment. This alignment technique is key to achieving the required accuracy in multiple wafer stacks for leading-edge technologies. SmartView technology can be combined with the GEMINI wafer bonding systems for subsequent permanent bonding in a fully automated platform.
Substrate / Wafer parameters |
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Size: 150 - 200, 200 - 300 mm |
Thickness: 0,1 - 5 mm |
Max. stack height: 10 mm |
Automatic alignment |
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Standard |
Handling system |
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3 cassette stations (up to 200 mm) or 2 FOUP load ports (300 mm) |