EVG®6200 NT

SmartNIL UV Nanoimprint Lithography System

A universal mask alignment system with UV Nanoimprint capability featuring EVG´s proprietary SmartNIL® technology up to 150 mm

Known for its automation flexibility and reliability, these systems provide state-of-the-art mask alignment technology on a minimized footprint. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes them the ideal solution for any R&D environment up to semi-automated volume production. The tool supports a variety of standard lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, with the option of back-side alignment. Additionally the system offers additional capabilities for multi-purpose configurations, including bond alignment and nanoimprint lithography. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.

SmartNIL is the industry-leading NIL technology, enabling the patterning of extremely small features down to less than 40 nm*, as well as a wide range of structure sizes and shapes. SmartNIL in combination with multi-use soft-stamp technology enables unmatched throughput with considerable cost-of-ownership advantages while preserving scalability and maintenance-friendly operation. EVG’s SmartNIL redeems the long-term promise of nanoimprinting being a low-cost and high-volume alternative lithography technology for mass manufacturing of micro- and nanoscale structures.
*resolution dependent on process and template 


  • Top-side and bottom-side alignment capability
  • High-precision alignment stage
  • Automated wedge compensation sequence
  • Motorized and recipe controlled exposure gap
  • Supports the latest UV-LED technology
  • Minimized system footprint and facility requirements
  • Step-by-step process guidance
  • Remote tech support
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
  • Agile processing and conversion re-tooling
  • Table top or stand-alone version with anti-vibration granite table
  • Additional capabilities:
    • Bond alignment
    • IR alignment
    • Smart NIL® 
    • µ-contact printing

Technical Data

Wafer diameter (substrate size)
Standard lithography: 75 up to 200 mm
Soft UV-NIL: 75 up to 200 mm
SmartNIL®: up to 150 mm
≤ 40 nm (resolution dependent upon template and process)
Supported Process
Soft UV-NIL & SmartNIL®
Exposure source
Mercury light source or UV LED light source
Soft-NIL: ≤ ± 0.5 µm
SmartNIL®: ≤ ± 3 µm
Automated separation
Soft UV NIL: not supported
SmartNIL®: supported
Working stamp fabrication
Soft UV-NIL: external
SmartNIL®: supported

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