IR Inspection System

IR and bond strength measurement of bonded wafer stacks

The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission allows void detection down to a radius of 500 µm which is a perfect match for fusion bonding processes.  In addition, the infrared inspection system supports bond strength measurements using the Maszara method.


  • IR live image
  • One-shot high-resolution inspection of the entire bonded wafer
  • Optional bond pin for live visualization of bond wave propagation
  • Fully automated bond strength measurement (Maszara test)
  • Void size detection down to 500 µm radius

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