EVG®850DB Automated Debonding System

For debonding, cleaning and unloading of thin wafers.

 

After further process steps on the device wafer (temporarily bonded on a carrier), which can include back thinning, lithography, metallization, etching, through via processing, etc., the device wafer is subsequently debonded from the carrier substrate before unloading into the dedicated output format. The debond method and the intermediate adhesive material are chosen based on the process steps of the temporary bonded wafer stack after the initial bonding. All thinned substrates are safely processed within the EVG850DB by a special handling system.

Features

  • Automated debonding for spin-on bonding adhesives or dry adhesive tapes
  • Automated cleaning of debonded wafer and carrier
  • Reliable handling of thinned, bowed and warped wafers with and without topography
  • Bridge tool capability  
  • Options
    • ID reading
    • megasonic nozzle for cleaning
    • various output formats

EVG Debonding Technologies

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