The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.
|Wafer diameter (substrate size)|
|Up to 300 mm wafer|
|Up to 12” film frame|
|1 debond module|
|High topography wafer handling|
|Bridge capability for different substrate sizes|