Fully automated debonding, cleaning and unloading of thin wafers
Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.
Features
- Reliable handling of thinned, bowed and warped wafers with and without topography
- Automated cleaning of debonded wafer
- Recipe controlled system
- Real time monitoring and recording of all relevant process parameters
- Fully integrated SECS/GEM interface in automated tools
- Bridge tool capability for different substrate sizes
- Modular tool layout → throughput-optimized depending on specific process
Technical Data
| Wafer diameter (substrate size) |
|---|
| Up to 300 mm |
| Up to 12“ film frame |
| Configuration |
|---|
| Debond module |
| Clean module |
| Film frame mounter |
| Options |
|---|
| ID reading |
| Various output formats |
| High topography wafer handling |
| Warped wafer handling |