EVG®620 BA

Automated Bond Alignment System

Automated bond alignment system for wafer-to-wafer alignment for research and pilot production

Known for its high level of automation and reliability, the EVG620 bond alignment system is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. EV Group´s bond alignment systems offer the highest precision, flexibility and ease of use, and modular upgrade capability, and have been qualified in numerous high-throughput production environments. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

Features

  • Most suitable for EVG®501, EVG®510, and EVG®520 IS bonding systems
  • Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
  • Manual or motorized alignment stage
  • Fully motorized high-resolution bottom-side microscopes
  • Windows® based user interface
  • Quick tool change between different wafer sizes and different bonding applications
  • Options
    • Automatic alignment
    • IR alignment for inner substrate key alignment
    • NanoAlign® package for enhanced process capabilities
    • Available with system rack
    • Upgrade possibility to mask aligner
EVG620 BA

Technical Data

General system configuration
Desktop
System rack: optional
Vibration isolation: passive
Alignment methods
Backside alignment: ± 2 µm 3 σ
Transparent alignment: ± 1 µm 3 σ
IR alignment: option
Alignment stage
Precision micrometers: manual
Optional: motorized micrometers
Wedge compensation: automated
Substrate / Wafer parameters
Size: 2", 3", 100 mm, 150 mm
Thickness: 0,1 - 10 mm
Max. stack height: 10 mm
Automatic alignment
Optional
Handling system
Standard: 3 cassette stations
Optional: up to 5 stations

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