The EVG®120 is a fully automated resist processing system designed for both low-volume and high-volume manufacturing, supporting wafers up to 200 mm
The next generation of the well-established EVG 120 features a new robot system, optimized parallel processing, a modular tool design, an optimized dispensing system, and a post-processing unit that includes wafer edge exposure. In addition, the system offers significant economic benefits such as yield improvement through in-situ resist thickness measurement, reduced cost of ownership with its compact footprint and optimized chemical usage as well as lower energy consumption via standby mode. The new EVG 120 can process a large variety of materials such as thin and thick resists, dielectrics, colored resists, and adhesives for applications in photolithography, wafer bonding and nanoimprint lithography. The coating thickness can range from 100 nm to several hundred µm.
Features
- Wafer sizes up to 200 mm
- Ultra-compact design with reduced footprint <1.9m2
- Up to 2 coating or development modules and 14 hot/chill plates
- Flexible modular configuration featuring spin coating / spray coating / development
- Up to 6 pumps and resist bottles integrated into the base frame; pumps and resists in shortest distance to point of use
- CoverSpin™ bowl design providing superior uniformity and reduced material consumption
- Proprietary OmniSpray® ultrasonic atomization technology for conformal coating of topography wafers and fragile substrates
- User friendly GUI with multi–user concept
- New CIMFramework software featuring smart process control and data analysis features
- Equipment and process performance tracking and data analysis features
- Parallel/queueing task processing feature
- Smart handling features
- Smart maintenance and tracking features
Technical Data
| Wafer diameter (substrate size) |
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| Up to 200 mm |
| Available modules |
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| Spin / spray / develop |
| Bake / chill units |
| Wafer handling options |
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| Single, double EE, edge handling, wafer flipping |
| Bowed / warped / thin / glass wafer handling |
| Industrial automation features |
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| SMIF loadports / SECS / GEM |
| Dispense options |
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| Various resist dispense pumps to cover a wide range of viscosities up to 50.000 cP |
| High-viscosity dispense System with closed-loop feedback |
| Post Processing Station |
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| Wafer edge exposure |
| Resist film thickness measurement |
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