LITHOSCALE^® XT

EVG’s LITHOSCALE® XT provides up to a five-fold increase in throughput versus the previous industry benchmark LITHOSCALE® system, supporting 300mm wafers and 300mm square substrates. The system is ideally suited for applications involving multi-die patterning, fan-out wafer-level packaging (FoWLP) for AI and high-performance computing (HPC) devices, panel-level packaging (PLP), MEMS, advanced imaging sensors, and die traceability for security and automotive applications. The LITHOSCALE® XT processing pipeline digitally transforms vectorized pattern data and compensates for distortions during exposure based on pre-measured and real-time acquired alignment information.

Operating at single or, simultaneously, at two wavelength bands (λ≈375 and 405 nm), thin & thick resists, dielectric materials, transparent, black, RGB or IR resists as well as many other established and novel materials are optimally exposed. An individual ‘exposure matrix’ permits to select arbitrary pairs of test parameters, such as exposure dose, spectral composition focal position, and exposure speed, to quickly determine the optimum process recipe and multi-dimensional process windows during the production ramp–up phase, thereby minimizing set-up times and simplifying material changes. This equipment allows for excellent process control, including sidewall profile, complex topography structure and high aspect ratio patterning. Exposure is performed on the full wafer surface, demonstrating zero stitch performance.

The LITHOSCALE® XT is a prime example of a digital high-volume lithography system for advanced packaging applications. Its real-time auto focus, high depth of focus, dynamic distortion compensation, and broad process–matrix capabilities prove the benefits of the technology vs. traditional exposure systems for next-generation devices.