Lithography Track System

The HERCULES® is a high-volume platform integrating the entire lithography process flow in one system, reducing process footprint and operator support.

Based on a modular platform, the HERCULES combines EVG’s established optical mask alignment technology with integrated wafer cleaning, resist coating, baking and resist development modules. The HERCULES enables cassette-to-cassette processing of various wafer sizes. The HERCULES safely handles thick, highly bowed, rectangular, small-diameter wafers or even device trays. Precision top-side and bottom-side alignment as well as coating of sub-micron to ultra-thick (up to 300 microns) resists can be applied for interlayer and passivation applications. The superior alignment stage design achieves highly accurate alignment and exposure results at high throughput.


  • Production platform combines all advantages of EVG’s precision alignment and resist processing systems in a minimized footprint
  • Versatile platform supports fully automated processing of various substrate shapes, sizes, highly warped mold wafers and even trays
  • Coating of up to 52,000 cP enables manufacturing of ultra-thick resist features of up to 300 microns in height
  • CoverSpinTM rotating cover for low resist consumption and optimized resist coating uniformity
  • OmniSpray® coating for optimized coating of high topography surfaces
  • NanoSpray® for coating and protection of via structures
  • Automated mask handling and storage
  • Optical edge exposure and/or solvent cleaning for edge bead removal
  • Fragile, thin or warped wafer handling of multiple wafer sizes with bridge-tool system
  • Rework sorting wafer management and flexible cassette system
  • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)

Technical Data

Alignment modes
Top side alignment: ≤ ± 0,5 µm
Bottom side alignment: ≤ ± 1,0 µm
IR alignment: ≤ ± 2,0 µm/ substrate material depending
Advanced alignment features
Manual alignment
Automatic alignment
Dynamic alignment
Alignment offset correction
Automatic cross correction / manual cross correction
Large gap alignment
Industrial automation features
Cassette / SMIF / FOUP / SECS/GEM / thin, bowed, warped, edge wafer handling
Exposure source
Mercury light source / UV LED light source
Exposure setup
Vacuum contact / hard contact / soft contact / proximity mode / flex mode
Wedge compensation
Fully automatic - SW controlled
Exposure options
Interval exposure / flood exposure / sector exposure
System control
Operations system: Windows
File sharing & back-up solution / unlimited no. recipes & parameters
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR
Real-time remote access, diagnostics & troubleshooting

Talk to our EVG product experts!