A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.
Fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding
Configuration options for bottom-side, IR or SmartView alignment
Multiple bonding chambers
Wafer handling system is separated from bond chuck handling system
Modular design with swap-in modules
Combines all benefits from EVG's precision aligners and EVG®500 series systems
Minimized footprint compared to stand-alone systems